Suara Malaysia
ADVERTISEMENTFly London from Kuala LumpurFly London from Kuala Lumpur
Friday, September 20, 2024
More
    ADVERTISEMENTFly London from Kuala LumpurFly London from Kuala Lumpur
    HomeTechGerman wafer fab JV formed by Bosch, Infineon, NXP, TSMC.

    German wafer fab JV formed by Bosch, Infineon, NXP, TSMC.

    -

    Fly AirAsia from Kuala Lumpur

    BERLIN (Reuters) – German technology group Robert Bosch said on Tuesday that it will establish a joint venture with TSMC, Infineon and NXP with the aim of building a wafer fab in Dresden, Germany, by the second half of next year.

    The joint venture will be 70% owned by TSMC, with Bosch, Infineon and NXP each holding a 10% equity stake, according to a statement, and total investments are expected to exceed 10 billion euros ($10.97 billion) via equity injection, debt borrowing, and strong support from the European Union and German government.

    ($1 = 0.9120 euros)

    (Writing by Miranda Murray, Editing by Friederike Heine)


    Credit: The Star : Tech Feed

    Wan
    Wan
    Dedicated wordsmith and passionate storyteller, on a mission to captivate minds and ignite imaginations.

    Related articles

    Follow Us

    20,249FansLike
    1,158FollowersFollow
    1,051FollowersFollow
    1,251FollowersFollow
    ADVERTISEMENTFly London from Kuala Lumpur

    Subscribe to Newsletter

    To be updated with all the latest news, offers and special announcements.

    Latest posts