Intel Corp is placing its bet on using glass as a solution to handle the increasing artificial intelligence (AI) workloads faced by computers. According to Intel researchers, as processors become larger and more complex, their ability to communicate with the rest of the computer is becoming a bottleneck. The company believes that glass-based substrates, situated between the chip and connecting components, can address this challenge.
This new approach allows Intel, a chip pioneer now competing with Nvidia Corp, to showcase its innovative capabilities in the AI era and attract new customers. The company has significantly increased its research and development (R&D) spending to nearly US$18 billion (RM84.39 billion) per year, surpassing its peers.
Intel’s focus on glass stems from its packaging research and production facilities, a lesser-known part of its technology lineup. By raising the profile of this business, Intel aims to attract customers to its manufacturing operations as part of a larger effort. In contrast to the company’s historical focus on producing its own designs, Intel is prioritizing the expansion of its foundry operations, which create semiconductors and other technologies for external customers, marking one of the most significant shake-ups in the company’s 55-year history.
Intel CEO Pat Gelsinger has been highlighting the company’s capabilities in chip packaging, a technology that surrounds chips. According to Gelsinger, Intel is making progress in signing up customers for its packaging services, even if these customers bring chips sourced from elsewhere. The packaging business serves as a means to attract clients, who may subsequently choose Intel for a wider range of chipmaking needs. This strategic move comes with substantial risks, as Intel is investing billions in new plants worldwide, banking on external customers to keep these operations profitable.
Gelsinger seeks to restore Intel as a leader in the US$580 billion (RM2.71 trillion) chip industry and will headline Intel’s annual technology conference later this week. With the glass packaging initiative, Intel aims to be the first to commercialize a technology that has been in academic research for several years. The company predicts that existing techniques will become obsolete in the latter half of this decade, creating an urgent need for new solutions.
For the past two decades, the substrate that protects the silicon on chips has comprised a combination of fiberglass and epoxy due to its low cost and industry-wide adoption. However, as chips contain increasingly billions of transistors, driven in part by AI software requirements, the limitations of this packaging layer are becoming apparent. The epoxy and fiberglass mixture restrict the scaling down of power and data pathways, while increasing the number of holes in the flexible substrate leads to warping and potential loss of contact. Intel claims that glass can overcome these challenges. The material remains stable, allows for finer data pathways, and expands and contracts at the same rate as silicon under high temperatures, thanks to its shared chemical properties with silicon.
However, before this approach can become mainstream, Intel needs to obtain a more affordable supply of glass and refine handling techniques to mitigate its fragility. Around 4,200 Intel employees are currently dedicated to packaging techniques, including other enhancements, at the company’s Chandler, Arizona site. – Bloomberg
Credit: The Star : Tech Feed
